Enclosure with locally-flexible regions

ABSTRACT

A force input/haptic output interface for an electronic device can include a force input sensor and a haptic actuator. In one example, the force input sensor and the haptic actuator are accommodated on a frame positioned below an input surface. In many examples, the frame includes relieved portions that redirect and/or concentrate compression or tension in the haptic actuator into the frame.

FIELD

Embodiments described herein relate to user interfaces for electronicdevices, and in particular, to electronic device enclosures that includea distribution of locally-flexible regions that can be coupled to hapticactuators to provide haptic output to that user.

BACKGROUND

An input sensor for an electronic device can detect when a user appliesa purposeful force, generally referred to as a “force input,” to asurface of the electronic device. Such sensors, together with associatedcircuitry and structure, can be referred to as “force input sensors.”

A mechanical actuator for an electronic device can generate a mechanicaloutput, generally referred to as a “haptic output,” through a surface ofthe electronic device. Such actuators, together with associatedcircuitry and structure, can be referred to as “haptic actuators.”

In some cases, an electronic device can associate a force input sensorand a haptic actuator with the same surface, generally referred to as an“user interface surface.” Conventionally, a user interface surface, suchas a trackpad of a laptop computer, extends through an opening definedin an enclosure of the electronic device. However, as a result of theopening, the enclosure of the electronic device may be undesirablystructurally weakened, increasing manufacturing complexity andsusceptibility of the electronic device to damage.

SUMMARY

Embodiments described generally reference an electronic device thatincludes a force input/haptic output interface integrated into, orassociated with, an enclosure of the electronic device. Morespecifically, an electronic device such as described herein ispositioned in an enclosure that has an external surface (which may becontiguous) and an interior surface opposite the external surface. Inmany embodiments, a frame, internal to the enclosure, is coupled to theinterior surface. The frame includes a locally-flexible region that isdefined, at least in part, by a reduced-thickness section and a supportstructure adjacent to reduced-thickness section. A force transducer(such as a piezoelectric element) is coupled to the support structure.As a result of this construction, an actuation of the force transducerinduces a bending moment into the support structure to generate a hapticoutput through the external surface.

In some embodiments, more than one locally-flexible region and,correspondingly, more than one force transducer may be associated withthe frame. In other embodiments, the frame may be integrated with theinterior surface of the enclosure. In many examples, the enclosure isformed from glass, but this is not required.

Further embodiments described generally reference an electronic deviceincluding an enclosure formed from glass that accommodates a keyboard inan upper region of an external surface. The enclosure also accommodatesa force input/haptic output interface (such as described herein) in alower region of the external surface, generally below the keyboard. Inthese examples, locally-flexible regions may not be required; a hapticactuator or a piezoelectric element can be coupled directly to aninterior surface of the lower portion of the external surface of theenclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference will now be made to representative embodiments illustrated inthe accompanying figures. It should be understood that the followingdescriptions are not intended to limit this disclosure to one preferredembodiment. To the contrary, the disclosure provided herein is intendedto cover alternatives, modifications, and equivalents as may be includedwithin the spirit and scope of the described embodiments, and as definedby the appended claims.

FIG. 1 depicts an electronic device that can incorporate a forceinput/haptic output interface, such as described herein.

FIG. 2A depicts an example distribution of locally-flexible regionsdefined into an interior surface of an electronic device, such as theelectronic device of FIG. 1, that may be associated with a forceinput/haptic output interface.

FIG. 2B depicts a locally-flexible region of the enclosure depicted inFIG. 2A.

FIG. 2C depicts another view of the locally-flexible region depicted inFIG. 2B.

FIG. 2D depicts a locally-flexible region of the enclosure depicted inFIG. 2A, taken through line A-A.

FIG. 2E depicts the locally-flexible region of the enclosure depicted inFIG. 2D, showing flexion of the locally-flexible region.

FIG. 2F depicts another example locally-flexible region of an enclosure,such as depicted in FIG. 2A.

FIG. 2G depicts the locally-flexible region of the enclosure depicted inFIG. 2F, showing flexion of the locally-flexible region.

FIG. 3 depicts another example distribution of locally-flexible regionsassociated with a force input/haptic output interface.

FIG. 4 depicts another example distribution of locally-flexible regionsassociated with a force input/haptic output interface.

FIG. 5 depicts another example distribution of locally-flexible regionsassociated with a force input/haptic output interface.

FIG. 6A depicts a cross-section of an example force transducer coupledto a locally-flexible region of an interior surface of an electronicdevice enclosure, such as described herein.

FIG. 6B depicts a cross-section of another example force transducercoupled to a locally-flexible region of an interior surface of anelectronic device enclosure, such as described herein.

FIG. 6C depicts a cross-section of another example force transducercoupled to a locally-flexible region of an interior surface of anelectronic device enclosure, such as described herein.

FIG. 7 depicts another example distribution of locally-flexible regionsassociated with a force input/haptic output interface, such as describedherein.

FIG. 8 depicts another example distribution of locally-flexible regionsassociated with a force input/haptic output interface, such as describedherein.

FIG. 9 depicts a cross-section of an example force transducer coupled toa locally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 10 depicts a cross-section of another example force transducercoupled to a locally-flexible region of an interior surface of anelectronic device enclosure, such as described herein.

FIG. 11 depicts a cross-section of another example force transducer andlocally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 12 depicts a cross-section of another example force transducer andlocally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 13 depicts a cross-section of another example force transducer andlocally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 14 depicts a cross-section of another example force transducer andlocally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 15 depicts a cross-section of another example force transducer andlocally-flexible region of an interior surface of an electronic deviceenclosure, such as described herein.

FIG. 16 is a flow chart depicting example operations of a method offorming a haptic actuator, such as described herein.

FIG. 17 is a flow chart depicting example operations of a method ofproviding haptic feedback.

FIG. 18 is a flow chart depicting example operations of a method ofreceiving force input.

The use of the same or similar reference numerals in different figuresindicates similar, related, or identical items.

The use of cross-hatching or shading in the accompanying figures isgenerally provided to clarify the boundaries between adjacent elementsand also to facilitate legibility of the figures. Accordingly, neitherthe presence nor the absence of cross-hatching or shading conveys orindicates any preference or requirement for particular materials,material properties, element proportions, element dimensions,commonalities of similarly illustrated elements, or any othercharacteristic, attribute, or property for any element illustrated inthe accompanying figures.

Additionally, it should be understood that the proportions anddimensions (either relative or absolute) of the various features andelements (and collections and groupings thereof) and the boundaries,separations, and positional relationships presented therebetween, areprovided in the accompanying figures merely to facilitate anunderstanding of the various embodiments described herein and,accordingly, may not necessarily be presented or illustrated to scale,and are not intended to indicate any preference or requirement for anillustrated embodiment to the exclusion of embodiments described withreference thereto.

DETAILED DESCRIPTION

Embodiments described herein reference an electronic device thatincludes a force input/haptic output interface. The phrase “forceinput/haptic output interface,” as used herein, generally references asystem or set of components configured to receive force input at asurface from a user and, additionally, to provide haptic output to thatsame user through the same surface. The surface associated with a forceinput/haptic output interface (such as described herein) can be referredto as an “user interface surface.”

In one example, a force input/haptic output interface is operated inconjunction with, and/or positioned over, a display of an electronicdevice. In this example, the user interface surface can be a protectiveouter cover (e.g., transparent glass, sapphire, plastic) positioned overan active display area of the display. A user can exert a force onto theprotective outer cover to interact with content shown on the display atthat location. In response, the force input/haptic output interface cangenerate a haptic output (e.g., click, vibration, shift, drop, pop, andso on) through or on the display at, or near, that location to informthe user that the force input was received. In other examples, one ormore haptic outputs can be provided through the protective outer coverin response to, or independent of, one or more force inputs in adifferent or implementation-specific or configuration-specific manner.

In another example, a force input/haptic output interface is operated inconjunction with a user interface surface of an electronic device, suchas a trackpad. In this example, the user interface surface is acontinuous and planar external surface of the trackpad, which can beformed from an opaque or transparent material such as metal, glass,organic materials, synthetic materials, woven materials, and so on. Auser can exert a force onto a portion of the user interface surface toinstruct the electronic device to perform an action. In response, theforce input/haptic output interface can generate a haptic output at, ornear, that location to inform the user that the force input wasreceived. As with other example configurations, one or more hapticoutputs can be provided through the user interface surface in responseto, or independent of, one or more force inputs in a different orimplementation-specific or configuration-specific manner.

For simplicity of description, many embodiments that follow reference aforce input/haptic output interface operated in conjunction with anon-display region of a portable electronic device, such as a trackpadregion of a laptop computer. In these examples, the user interfacesurface is a contiguous external surface of the portable electronicdevice, although this may not be required. It may be appreciated,however, that this is merely one example; other configurations,implementations, and constructions are contemplated in view of thevarious principles and methods of operation, and alternatives thereto,described in reference to the embodiments that follow.

A force input/haptic output interface (such as described herein) can beimplemented with one or more force input sensors and/or one or morehaptic actuators. In some cases, a single component, referred to as a“force transducer,” can be configured to provide haptic output and toreceive force input. For simplicity of description, certain embodimentsthat follow reference a force transducer, but it may be appreciated thatthis is merely one example construction; other embodiments may includeseparate force input sensors and haptic actuators.

A force input/haptic output interface can be implemented with a set offorce transducers coupled to an interior surface of an enclosure of anelectronic device. Actuation of a force transducer induces a hapticoutput through an exterior surface of the enclosure, opposite theinterior surface. Similarly, a force applied to the exterior surface ofthe enclosure can locally deform the interior surface. In response tothe local deformation, the force transducer can generate or change asignal in a manner corresponding to the local deformation. The signal,in turn, can be correlated to a force input (e.g., a magnitude,direction, and/or location of force applied to the exterior surface).

It may be appreciated that the thickness of the enclosure separating theinterior surface from the exterior surface can affect one or morecharacteristics of a haptic output generated and/or one or morecharacteristics of a force input received. More specifically, thethicker the enclosure, the more attenuated haptic outputs and forceinputs may be.

In many embodiments, an enclosure of an electronic device can be formedto a structural thickness sufficient to support, enclose, and/or containcomponents and elements of an electronic device. An interior surface ofthe enclosure can be defined by regions that are thinned, stiffened, orsupported in a manner that confers specific mechanical properties tothose regions of the interior surface, such as greater local flexibilityor greater local stiffness.

In one example, an interior surface of an enclosure includes multiplelocally-flexible regions. A locally-flexible region can include one ormore cavities, openings, perforations, or reduced-thickness sectionsthat at least partially surround (or circumscribe) and define a supportstructure (e.g., a fixed-fixed beam having two ends, each of which areconstrained). A haptic actuator, as an example of a force transducer,can be coupled to the support structure such that compression orexpansion of the haptic actuator (parallel or perpendicular to theinterior surface) induces a bending moment (e.g., a deformation) in thesupport structure which, in turn, induces a haptic output through or onthe external surface of the electronic device enclosure. The degree towhich the support structure bends in response to actuation of the hapticactuator may be defined or controlled, at least in part, by the geometryof the reduced-thickness sections.

For example, the thinner a reduced-thickness section is, the more thesupport structure within the locally-flexible region may bend orotherwise deform. In some cases, a reduced-thickness section can includeone or more openings or perforations, but this may not be required ofall embodiments. In many embodiments, the reduced-thickness sectionshave a thickness that is less than the support structure and less thanthe enclosure. In some examples, the support structure may have athickness that is less than a thickness of the enclosure, but this maynot be required of all embodiments. In still further embodiments,locally-flexible regions may not be required and a force transducer maybe coupled directly to the interior surface of the electronic deviceenclosure.

In still further embodiments, the enclosure may have a substantiallyconstant thickness. In these examples, the enclosure may be locallystrengthened by a frame coupled to the interior surface of theenclosure. In this manner, regions of the interior surface of theenclosure that are not coupled to the frame may be more flexible (e.g.,locally-flexible) than regions that are supported by the frame.

These and other embodiments are discussed below with reference to FIGS.1-18. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanation only and should not be construed as limiting.

FIG. 1 shows an electronic device 100 that can include a forceinput/haptic output interface, such as described herein. As with otherembodiments, the force input/haptic output interface can be configuredto receive force input from a user and to provide haptic output to thatsame user. In some examples, the force input/haptic output interface isassociated with a display of the electronic device 100. For example, theforce input/haptic output interface may be positioned behind or along aperimeter of the display. In other examples, the force input/hapticoutput interface is associated with an input area of an enclosure theelectronic device 100, such as a trackpad area adjacent to a keyboardarea of an enclosure of a laptop computer.

For simplicity of description and illustration, the electronic device100 is depicted in FIG. 1 as a laptop computer having a forceinput/haptic output interface integrated into a trackpad. However, itmay be appreciated that this is merely one example and that otherimplementations of force input/haptic output interfaces can beintegrated into, associated with, or take the form of differentcomponents or systems of other electronic devices including, but notlimited to: desktop computers; tablet computers; cellular phones;wearable devices; peripheral devices; input devices; accessory devices;cover or case devices; industrial or residential control or automationdevices; automotive or aeronautical control or automation devices; ahome or building appliance; a craft or vehicle entertainment; control;and/or information system; a navigation device; and so on.

In the illustrated example, the electronic device 100 includes anenclosure 102 to retain, support, and/or enclose various electrical,mechanical, and structural components of the electronic device 100,including a primary display 104, a keyboard 106, and a secondary display108. The enclosure 102 can be formed from, as an example, glass,sapphire, ceramic, metal, or plastic, or any combinations thereof. Theelectronic device 100 can also include a processor, memory, power supplyand/or battery, network connections, sensors, input/output ports,acoustic elements, haptic actuators, digital and/or analog circuits forperforming and/or coordinating tasks of the electronic device 100, andso on. For simplicity of illustration, the electronic device 100 isdepicted in FIG. 1 without many of these elements, each of which may beincluded, partially and/or entirely, within the enclosure 102 and may beoperationally, structurally, or functionally associated with, or coupledto, the primary display 104, the keyboard 106, the secondary display108, and/or a force input/haptic output interface 110.

The force input/haptic output interface 110 includes a set of forcetransducers distributed relative to a user interface surface that may betouched by a user. In the illustrated embodiment, the user interfacesurface is positioned in, or projects from, a rectangular openingdefined through a lower portion of the enclosure 102. In otherembodiments, the user interface surface can extend across the width ofthe lower hinged portion of the enclosure 102. In still furtherembodiments, the opening and/or user interface surface can take anothershape.

In the illustrated example, the user interface surface associated withthe force input/haptic output interface 110 is separate from theenclosure 102. More particularly, the user interface surface ispositioned in an opening defined through the enclosure 102. The openingis depicted as a rounded rectangle, but may take any suitable shape.

The user interface surface can be formed from any number of suitablematerials. In some examples, the user interface surface is formed fromthe same material (or a similar material) as the enclosure 102, but thismay not be required. For example, in one embodiment, the enclosure 102is formed from metal and the user interface surface is formed fromglass. In another example, the enclosure 102 is formed from glass andthe user interface surface is formed from a ceramic material. In otherexamples, the user interface surface may be integrated into theenclosure 102. In many examples, the user interface surface isassociated with another interface or input system of the electronicdevice 100, such as a touch input system.

In some cases, the user interface surface can be integrated into orotherwise be a part of the enclosure 102. In other words, an openingdefined through the enclosure 102, such as shown, does not exist; theset of force transducers associated with the force input/haptic outputinterface 110 is coupled directly to an interior surface of theenclosure 102.

Each force transducer of the set of force transducers associated withthe force input/haptic output interface 110 can be arranged relative tothe user interface surface in a number of ways. For example, in someembodiments, the set of force transducers is arranged in a grid andincludes four separate force transducers. In other cases, the set offorce transducers contains five separate force transducers arranged inmultiple, offset, rows. In some cases, each force transducer has thesame shape, whereas in others certain force transducers may be larger orsmaller than others. More or fewer force transducers may be use in anyconfiguration and/or embodiment described herein.

Similarly, each force transducer associated with the force input/hapticoutput interface 110 can be coupled to the user interface surface in anyof a number of ways. For example, in some embodiments, each forcetransducer is coupled directly to the user interface surface using anadhesive. In other cases, each force transducer is coupled to asubstrate (e.g., a glass sheet) or frame that, in turn, is coupled tothe user interface surface.

Generally and broadly, FIGS. 2A-6C depict various example constructionsof a force input/haptic output interface. More specifically, theseembodiments generally take the form of a force input/haptic outputinterface that includes haptic actuators that are coupled tolocally-flexible regions defined into an interior surface of anelectronic device enclosure. In these embodiments, the locally-flexibleregions are each defined, at least part, by a reduced-thickness sectionthat in turn defines a complete or partial perimeter of a supportstructure that is coupled to a haptic actuator. In this manner,actuation of the haptic actuator induces a bending moment and/or otherdeformation in the support structure.

In one example, a locally-flexible region includes two parallelrectilinear reduced-thickness sections defining a support structurebetween them. In this manner, the support structure takes the form of abending beam that is fixed on two ends. In this example, the supportstructure has a thickness greater than that of the reduced-thicknesssections, but this may not be required of all embodiments.

In another example, a locally-flexible region includes two parallelrectilinear openings or apertures defining a support structure betweenthem. In other words, the two rectilinear openings are aligned with eachother and offset from each so as to define a support structure havingparticular flexibility or rigidity. In this manner, the supportstructure takes the form of a bending beam that is fixed on two ends.

In another example, a locally-flexible region includes onereduced-thickness section that defines three edges of a rectilinear asupport structure. In this manner, the support structure takes the formof a cantilevered beam that is fixed on one end.

In yet another example, a locally-flexible region includes fourreduced-thickness sections arranged in a grid, defining a cross-shapedsupport structure between them. In yet another example, alocally-flexible region includes curved reduced-thickness sections. Inyet another example, a locally-flexible region includes a number ofperforations in place of a reduced-thickness section. In yet anotherexample, a locally-flexible region includes a reduced-thickness sectionthat entirely circumscribes a support structure. In this manner, thesupport structure takes the form of an island surrounded entirely by areduced-thickness section.

Accordingly, generally and broadly, a locally-flexible region such asdescribed herein typically includes at least one reduced-thicknesssection (that may be or include an aperture) that defines at least aportion of a perimeter of a beam or support structure. A haptic actuatoris typically coupled to the beam or support structure.

For simplicity of description and illustration, the embodiments thatfollow reference one example construction of a locally-flexible regionincluding two substantially parallel rectilinear reduced-thicknesssections defining a support structure between them. It may beappreciated, however, that this is not required and a reduced-thicknesssection (or aperture or opening) and/or a locally-flexible region can besuitable configured differently in different embodiments.

For example, FIG. 2A depicts an example distribution of locally-flexibleregions formed or defined into an interior surface of an enclosure. Thelocal-flexible regions are shown in dashed lines as these regions arenot normally visible in the view depicted in FIG. 2A. Thelocally-flexible regions can be associated with a force input/hapticoutput interface incorporated into an electronic device 200. Inparticular, the electronic device 200 includes an enclosure 202 thatdefines an external surface 204. The external surface 204 may beassociated with a respective interior surface of the enclosure 202. Theexternal surface 204 may be contiguous and planar, although this is notrequired.

In the illustrated embodiment, the external surface 204 is shown with aregion that generally extends parallel to a length of a keyboard, suchas shown in FIG. 1, although this configuration is not required. Inother embodiments, the external surface 204 can be configured in anothermanner.

For example, in other cases, the external surface 204 can be definedelsewhere, relative to the enclosure 202. For example, the externalsurface 204 may be associated with a portion of the enclosure 202generally above the depicted keyboard (as used herein terms such as“above” and “below” are relative to a typical orientation of anelectronic device, such as the electronic device 200, when in use). Inother cases, the external surface 204 may be below the enclosure 202, onan underside of the electronic device. In still other cases, theexternal surface 204 may be defined in a sidewall or edge of theenclosure 202. It may be appreciated that the external surface 204,associated with the force input/haptic output interface, can be suitableconfigured in or incorporated into any suitable surface of the enclosure202.

In this embodiment, the external surface 204 defines an opening toaccommodate a user interface surface 206, which may be formed from adifferent material than the external surface 204. The opening is alignedapproximately in the center of the first region (e.g., a lower region)of the external surface 204 and extends approximately half a width ofthe lower region.

In the illustrated embodiment, four locally-flexible regions 208, 210,212, 214 are illustrated in phantom and defined into the interiorsurface of the enclosure 202. The four locally-flexible regions aredistributed in a two-by-two grid.

The four locally-flexible regions are typically configured andconstructed in the same manner, but this is not required. For example,in some embodiments, the locally-flexible region 208 and thelocally-flexible region 210 are configured as a first pair oflocally-flexible regions sharing one or more flexibility or rigidityproperties, whereas the locally-flexible region 212 and thelocally-flexible region 214 are configured as a second pair oflocally-flexible regions sharing one or more flexibility or rigidityproperties that are different than the properties of the first pair. Forsimplicity of description, the description that follows references thelocally-flexible region 208; it is appreciated that the locally-flexibleregions 210, 212, and 214 may be similarly configured.

Turning to FIGS. 2B-2E, the locally-flexible region 208 defines asupport structure 216 to support a haptic actuator 218, such as apiezoelectric element. The support structure 216 is bordered by tworeduced-thickness sections, identified as the reduced-thickness sections220 a and 220 b. The reduced-thickness sections 220 a and 220 b have athickness less than that of the enclosure 202 and less than that of thesupport structure 216. The reduced-thickness sections 220 a and 220 bcan be formed into the interior surface of the enclosure 202 in anysuitable manner including, but not limited to: ablation; etching;stamping; scribing; and so on. In some examples, the reduced-thicknesssections 220 a and 220 b include one or more apertures or perforations(not shown). The interior surface of the enclosure 202 is identified inFIGS. 2B-2C as the interior surface 222.

In the illustrated example, and as shown in FIGS. 2B-2C, the supportstructure 216 is a rectilinear bending beam with two fixed ends, a firstend 216 a and a second end 216 b. (see, e.g., FIG. 2A and FIGS. 2D-2E).However, this is merely one example. In other embodiments, the supportstructure 216 can take any number of suitable shapes including, but notlimited to: a cross shape; a circular shape; a curved shape; aspoke-and-hub shape; and so on.

In some cases, the support structure 216 can have a thickness that isless than that of the enclosure 202 and/or the user interface surface206, although this may not be required. For example, as illustrated (seeFIGS. 2B-2C), the support structure 216 has a thickness less than thatof the enclosure 202.

As a result of this construction, compression or expansion of the hapticactuator 218 in a direction parallel to the user interface surface 206induces a bending moment, deforming either toward the user interfacesurface 206 or toward an interior volume within the enclosure 202, inthe support structure 216. FIG. 2E depicts an outward deformation of theuser interface surface 206 as a result of a compression of the hapticactuator 208. More specifically, parallel compression of the hapticactuator 208 (e.g., parallel to the user interface surface 206) resultsin perpendicular deformation of the user interface surface 206. In othercases, the user interface surface 206 may deform inwardly. In stillother embodiments, the user interface surface 206 may deform bothoutwardly and inwardly (e.g., oscillation or vibration).

In another example, the haptic actuator 218 can compress or expand in adirection perpendicular to the user interface surface 206. For example,as illustrated in FIG. 2F, an enclosure 224 can include alocally-flexible region 226 of an external user interface surface. Thelocally-flexible region 226 can be positioned opposite an internal frame228. A haptic actuator 230 is positioned between the internal frame 228and the locally-flexible region 224.

As a result of this construction, compression or expansion of the hapticactuator 230 in a direction perpendicular to the locally-flexible region226 induces a bending moment, deforming the locally-flexible region 226either outward or, alternatively, toward an interior volume within theenclosure 224, in the support structure 216. FIG. 2G depicts an outwarddeformation of the locally-flexible region 226 as a result of anexpansion of the haptic actuator 230. More specifically, perpendicularexpansion of the haptic actuator 230 (e.g., perpendicular to thelocally-flexible region 226) results in perpendicular deformation of thelocally-flexible region 226. In other cases, the locally-flexible region226 may deform inwardly. In still other embodiments, thelocally-flexible region 226 may deform both outwardly and inwardly(e.g., oscillation or vibration).

Other embodiments can be implemented in another manner. For example,FIG. 3 depicts another example distribution of force transducers, eachassociated with a respective locally-flexible region defined into aninterior surface of the enclosure, and that can be associated with aforce input/haptic output interface incorporated into an electronicdevice 300. In particular, the electronic device 300 includes anenclosure 302 that defines an external surface 304. The external surface304 defines an upper region and a lower region. In this embodiment, theexternal surface 304 defines the user interface surface; no opening orseparate layer to define the interface is required. In this manner, thevisual continuity of the external surface 304 is not interrupted. Thelocally-flexible regions can be formed into an interior surface of theenclosure 302 below the lower region of the external surface 304.

In the illustrated embodiment, the interior surface of the enclosure 302defines ten locally-flexible regions associated with ten forcetransducers, arranged in two parallel rows (e.g., each local-flexibleregion positioned in a selected location). One of the force transducersis labeled as the force transducer 306. As with other embodimentsdescribed herein, the force transducer 306 is coupled to alocally-flexible region defined into the interior surface of theenclosure 302. In some embodiments, the locally-flexible region isdefined into or defined by a frame coupled to the interior surface ofthe enclosure 302.

In the illustrated example, the frame includes reduced-thicknesssections that cooperate to define a rectilinear bending beam (identifiedas the support structure 308) having two fixed ends, identified as thefixed ends 308 a and 308 b. In the illustrated embodiment, thereduced-thickness sections are identified as the reduced-thicknesssections 310 a and 310 b. In this manner, the frame defineslocally-flexible region similar to the local-flexible regions referencedwith respect to other embodiments described herein.

A piezoelectric element 312 is positioned on the support structure 308.In other embodiments, the support structure 308 can take any number ofsuitable shapes including, but not limited to: a cross shape, a circularshape, a curved shape, a spoke-and-hub shape, and so on.

As a result of the depicted construction, compression or expansion ofthe piezoelectric element 318 induces a bending moment within thesupport structure 308, either toward the external surface 304 of theenclosure 302 or toward an interior volume within the enclosure 302.

Still further embodiments can be implemented in another manner. Forexample, FIG. 4 depicts an electronic device 400 that includes anotherexample distribution of force transducers that can be associated with aforce input/haptic output interface. In particular, the electronicdevice 400 includes an enclosure 402 that defines a user interfacesurface 404 that extends across an entirety of a width of a lowerportion of the enclosure 402, substantially parallel to a length of akeyboard positioned in an upper portion of the enclosure 402.

In the illustrated embodiment, the interior surface of the enclosure 402includes two parallel rows of locally-flexible regions, identified asthe upper row 406 and the lower row 408. In this example, the lower row408 can include locally-flexible regions that have different mechanicalproperties than the locally-flexible regions of the upper row 406. Inparticular, the locally-flexible regions of the lower row 408 may bemore rigid (e.g., smaller in area) than the locally-flexible region ofthe upper row 406.

Still other configurations and constructions may be implemented. Forexample, FIG. 5 depicts an electronic device 500 with another exampledistribution of force transducers. The electronic device 500 includes anenclosure 502 that defines a user interface surface 504. In theillustrated embodiment, a set of locally-flexible regions defined intothe internal surface of the enclosure 502 supports a number of forcetransducers, arranged in three parallel rows, one of which is identifiedas the row 506.

As noted above with respect to other embodiments, the locally-flexibleregions are typically configured and constructed in the same manner, butthis is not required. For example, in some embodiments, the row 506 mayinclude a locally-flexible region that exhibit different mechanicalproperties. For example, a first locally-flexible region 508 may includewith a cantilevered 510 (e.g., a cantilevered beam) that is defined by areduced-thickness section 512. A second locally-flexible region 514 maybe associated with a pair of reduced-thickness sections that cooperateto define a rectilinear bending beam having two fixed ends, such asdescribed with respect to other embodiments herein.

In this example, each row of force transducers includes the same numberof force transducers, but configuration this is not required. Forexample, in some embodiments, different rows of force transducers mayinclude a different number or arrangement of force transducers.

The foregoing embodiments depicted in FIGS. 2A-5 and the variousalternatives thereof and variations thereto are presented, generally,for purposes of explanation, and to facilitate an understanding ofvarious configurations of a force input/haptic output interface and thevarious components thereof, such as described herein. However, it willbe apparent to one skilled in the art that some of the specific detailspresented herein may not be required in order to practice a particulardescribed embodiment, or an equivalent thereof.

For example, it may be understood that, generally and broadly,embodiments described herein can arrange any suitable number of forcetransducers in any number of suitable patterns including, but notlimited to: grid patterns; column-and-row patterns; alternatingpatterns; repeating patterns; tessellated patterns; offset patterns; andso on. Further, it may be appreciated that in certain examples,locally-flexible regions may be included to define or modify particularload paths through a frame supporting the various force transducers oran interior surface of an electronic device enclosure that supports thevarious force transducers. In other embodiments, the locally-flexibleregions are associated with reduced-thickness sections (e.g., formed byabrasion, ablation, etching, molding, and so on).

Further, it may be understood that, although the foregoing embodimentsreference force transducers implemented with piezoelectric elements,this configuration is not required. In other embodiments, otherelectroactive elements, materials, or constructions may be used.Suitable materials and constructions may include, without limitation:electroactive polymers; shape-change or memory-wire (e.g., nitinol);ferroelectric polymers; microelectromechanical systems; magneticattractors; linear actuators; solenoid-based systems; and so on.

Further, in many examples, the support structures depicted and describedin reference to FIGS. 2A-5 may not share a uniform thickness withadjacent portions of the interior surface of an electronic deviceenclosure. For example, FIGS. 6A-6C generally and broadly depictcross-sections of an example force transducer coupled to alocally-flexible region, such as a frame or an interior surface of anelectronic device enclosure.

In particular, FIG. 6A depicts a cross-section of an example forcetransducer 600 a coupled to a locally-flexible region 602 of anenclosure, such as described herein. The cross-section is taken throughline A-A of FIG. 2A, and shows an embodiment different than that ofFIGS. 2B-2E. The locally-flexible region 602 includes a relieved section604 that forms a support structure. The relieved section 604 has athickness less than that of portions of the locally-flexible region 602adjacent to the relieved section 604.

The relieved section 604 can be formed in any number of suitable ways.For example, the relieved section 604 can be formed by laser ablation,mechanical etching, chemical etching, or any combination thereof. Apiezoelectric element 606 is coupled to the relieved section 604 suchthat compression or expansion of the piezoelectric element 606 induces abending moment in the relieved section 604. Similarly, bending of therelieved section 604 can result in a concentration of compression ortension in the piezoelectric element 606.

FIG. 6B depicts a cross-section of an example force transducer 600 bcoupled to a locally-flexible region 602, such as described herein. Thelocally-flexible region 602 includes a first relieved section 610opposite a second relieved section 612 (e.g., different surface of anenclosure). More specifically, the first relived section 610 may bedefined into an external surface of a housing and the second relivedsection may be defined into an internal surface of the housing. Thecombination of the first relieved section 610 and the second relievedsection 612 results in a thickness less than that of portions of thelocally-flexible region 602 adjacent to those sections.

The relieved sections can be formed, and may function, as described withrespect to other embodiments described herein (e.g., FIGS. 2A-5).

Although illustrated as opposite one another, one may appreciate thatthe first relieved section 610 and the second relieved section 612 neednot be symmetrically formed. For example, in some embodiments, thesecond relieved section 612 may be wider than the first relieved section610. In other cases, the second relieved section 612 may only partiallyoverlap the first relieved section 610.

In still further embodiments, a locally-flexible region can be formed bystiffening or supporting one substrate layer (e.g., an outer layer of anelectronic device enclosure) with a second substrate layer. For example,FIG. 6C depicts a cross-section of another example force transducercoupled to a locally-flexible region. The locally-flexible region 600 cis defined by a substrate layer 614 that is strengthened by a backingplate 616. In some embodiments, the backing plate can be referred to asa “frame” that provides mechanical support to the substrate layer 614.The backing plate 616 increases the thickness of certain portions of thesubstrate layer 614. In this manner, a relieved section is formed. Therelieved section is coupled to a piezoelectric element 606, as withpreviously-discussed embodiments.

The foregoing embodiments depicted in FIGS. 6A-6C and the variousalternatives thereof and variations thereto are presented, generally,for purposes of explanation, and to facilitate an understanding ofvarious constructions and distributions of force transducers (and,correspondingly, force input sensors and haptic output elements) and thevarious components thereof, such as described herein. However, it willbe apparent to one skilled in the art that some of the specific detailspresented herein may not be required in order to practice a particulardescribed embodiment, or an equivalent thereof.

Generally and broadly, FIGS. 7-8 depict various example constructions ofa force input/haptic output interface. Each depicts a different examplearrangement of force transducers relative to a user interface surface.

For example, FIG. 7 depicts an example distribution of force transducersthat can be associated with a force input/haptic output interfaceincorporated into an electronic device 700. In particular, theelectronic device 700 includes an enclosure 702 that defines an externalsurface 704. In this embodiment, as with the embodiment depicted in FIG.2, the external surface 704 defines an opening to accommodate a userinterface substrate 706. In some examples, the user interface substrate706 and the external surface 704 may be flush, but this may not berequired of all embodiments. For example, in some implementations, theuser interface substrate 706 protrudes from the external surface 704.

In some embodiments, the user interface substrate 706 can be coupled toa frame (not shown) that is disposed within the enclosure 702. The framecan be made from any number of suitable materials including metals,plastics, glasses, and so on. In one example, the frame is coupled(e.g., via fasteners, adhesive, and so on) to an internal surface of theenclosure 702.

In the illustrated embodiment, the frame supports four force transducers708, 710, 712, and 714. The four force transducers are arranged in atwo-by-two grid.

The four force transducers are typically configured and constructed inthe same manner, but this is not required. For example, in someembodiments, the force transducer 708 and the force transducer 710 areconfigured as a first pair of transducers sharing one or more propertieswhereas the force transducer 712 and the force transducer 714 areconfigured as a second pair of transducers sharing one or moreproperties different than the properties of the first pair. Forsimplicity of description, the description that follows references theforce transducer 708; it is appreciated that the force transducers 710,712, and 714 may be similarly configured.

The force transducer 708 is formed from a piezoelectric material havinga crystalline structure that mechanically distorts when an electricfield is applied to it. Suitable materials can include lead zirconatetitante and potassium sodium niobate. In other examples, the forcetransducer 708 can be formed from an electroactive polymer, anelectromagnetic coil and a ferromagnetic or magnetic plate, or an anycombination thereof.

As a result of this construction, compression or expansion of the forcetransducer 708 induces a deformation in the user interface substrate706. Similarly, a compression of the suspended of the user interfacesubstrate 706 induces a compression of the force transducer 708.

In other embodiments, one or more force transducers of a forceinput/haptic output interface can be distributed in a different manner.For example, FIG. 8 depicts another sample force input/haptic outputinterface incorporated into an electronic device 800. In particular, theelectronic device 800 includes an enclosure 802 that includes two rowsof force transducers (or haptic actuators or force input sensors),identified as the upper row 804 and the lower row 806. The upper row 804and the lower row 806 are coupled to an interior surface of theenclosure, generally below a keyboard. The two rows, as illustrated,each include four force transducers.

The foregoing embodiments depicted in FIGS. 7-8 and the variousalternatives thereof and variations thereto are presented, generally,for purposes of explanation, and to facilitate an understanding ofvarious alternative configurations of a force and the various componentsthereof, such as described herein. However, it will be apparent to oneskilled in the art that some of the specific details presented hereinmay not be required in order to practice a particular describedembodiment, or an equivalent thereof.

For example, it may be understood that, generally and broadly,embodiments described herein can arrange any suitable number of forcetransducers in any number of suitable patterns including, but notlimited to: grid patterns; column-and-row patterns; alternatingpatterns; repeating patterns; tessellated patterns; offset patterns, andso on.

Further, it may be understood that although the foregoing embodimentsreference force transducers implemented with piezoelectric elements,this configuration is not required; in other embodiments, otherelectroactive elements, materials, or constructions may be used.Suitable materials and constructions may include, without limitation:electroactive polymers; shape-change or memory-wire (e.g., nitinol);ferroelectric polymers; microelectromechanical systems; magneticattractors; linear actuators; solenoid-based systems; and so on.

Further, as with other embodiments described herein, the forcetransducers depicted and described in reference to FIGS. 7-8 may notshare a uniform thickness with adjacent portions of the frame or theinterior surface of an electronic device enclosure. For example, alocally-flexible region can be formed by stiffening or supporting onesubstrate layer with a second substrate layer. For example, FIG. 9depicts a cross-section taken through line B-B of FIG. 7, showinganother example force transducer coupled to a locally-flexible region.The locally-flexible region 900 is defined by a substrate layer 902 thatcan couple to a force transducer 904. The substrate layer 902 isstrengthened by a backing plate 906. The backing plate 906 increases thethickness of certain portions of the substrate layer 902, therebyforming a relieved section 908.

In further examples, a force input/haptic output interface can beintegrated within an electronic device in another manner. For example,as noted above, a force input/haptic output interface may be implementedin conjunction with a touch input sensor. FIGS. 10-14 depict examples ofsuch configurations.

For example, FIG. 10 depicts a cross-section (e.g., taken through lineB-B of FIG. 7, showing a different embodiment than that of FIG. 9) of anexample force input/haptic output interface. In this example, the forceinput/haptic output interface 1000 includes a force input sensor and ahaptic output element.

The force input/haptic output interface 1000 is associated with anexternal cover 1002 that defines an input surface to receive user input(e.g., force and touch) and to provide haptic output. The external cover1002 is positioned over and coupled to a frame 1004 via a compressibleseal 1006. The compressible seal 1006 can provide relief to the externalcover 1002 when a user applies a force to the external cover 1002. Inother cases, the compressible seal 1006 provides an environmental orhermetic seal to protect one or more components internal to the forceinput/haptic output interface 1000. In the illustrated example, a touchinput sensor 1008 is disposed on an interior surface of the externalcover 1002.

The force input/haptic output interface 1000 also includes a hapticactuator 1010 that is coupled to a reduced-thickness section of theframe 1004, identified as the reduced-thickness section 1004 a. Morespecifically, the haptic actuator 1010 is coupled to a lower surface ofthe reduced-thickness section 1004 a. As with other embodimentsdescribed herein, the haptic actuator 1010 can include a piezoelectricelement.

The frame 1004 can be configured to provide mechanical support to one ormore portions of the force input/haptic output interface 1000. In otherexamples, the frame 1004 can provide a means of coupling the externalcover 1002 to functional portions of the force input/haptic outputinterface 1000. More specifically, the frame 1004 can include one ormore surfaces configured to adhere to one or more surfaces of theexternal cover 1002.

The material or construction of the frame 1004 may be selected at leastin part to provide a particular haptic output in response to acompression or deformation of the haptic actuator 1010. For example, athickness of the frame 1004 can influence one or more characteristics ofa haptic output generated by the haptic actuator 1010 that is coupled tothat frame; a thicker frame may result in attenuation of low frequencyoutputs from the haptic actuator 1010 whereas a thinner frame may resultin attenuation of high frequency outputs from the haptic actuator 1010.

Similarly, the material of the frame 1004 can influence one or morecharacteristics of a haptic output generated by the haptic actuator 1010that is coupled to that frame. For example, an aluminum frame may resultin a different haptic output than a copper frame, a plastic frame, or aglass frame.

In many embodiments, the frame 1004 is formed from a different materialthan the external cover 1002. For example, the frame 1004 can be formedfrom metal and the external cover 1002 can be formed from glass.

The force input/haptic output interface 1000 also includes a capacitiveforce sensor 1012. The capacitive force sensor 1012 can be defined bytwo or more electrical contacts separated by a flexible material suchas, but not limited to: silicone; plastic; glass; gel; and so on. Insome cases, the flexible material of the capacitive force sensor 1012may have a non-Newtonian response such that when the frame 1004 deformsin response to an actuation of the haptic actuator 1010, the deformationof the frame 1004 is rigidly translated to the external cover 1002.

The flexible material of the capacitive force sensor 1012 need not becontinuous; in the illustrated example, the flexible material isimplemented as three separate flexible dot elements, but this is notrequired. As a result of this construction, when a force is applied(e.g., by a user) to the external cover 1002, the flexible material ofthe capacitive force sensor 1012 can compress, reducing the distancebetween the two or more electrical contacts and changing the capacitanceof the capacitive force sensor 1012. This change in capacitance can bemeasured by a controller (that can include drive circuitry, sensecircuitry, and the like) coupled to or otherwise in electricalcommunication with the capacitive force sensor 1012, which in turn, cancorrelate the capacitance change (or absolute capacitance) to amagnitude of force applied by the user to the external cover 1002. Instill further examples, the capacitive force sensor 1012 can providemechanical relief to the external cover 1002.

In this example, the haptic actuator 1010 can be configured to providehaptic output to a user and the force sensor 1012 can be configured toreceive force input from the same user.

In another embodiment, the force input/haptic output interface can beimplemented in a different manner. For example, FIG. 11 depicts across-section of a force input/haptic output interface 1100, such asdescribed herein. In this embodiment, the force input/haptic outputinterface 1000 includes a touch input sensor, a force input sensor, anda haptic output element. In this example, the haptic output element ispositioned below the force input sensor.

As with other embodiments described herein, the force input/hapticoutput interface includes an external cover 1102 that defines an inputsurface to receive user input and to provide haptic output. The externalcover 1102 is positioned over and coupled to a frame 1104 via acompressible seal 1106, that may be configured and function similarly tocompressible seals described in reference to other embodiments herein. Atouch input sensor 1108 is disposed on an interior surface of theexternal cover 1102. The touch input sensor 1108 can be implemented as acapacitive touch sensor.

As with other embodiments described herein, the force input/hapticoutput interface 1100 also includes a capacitive force sensor 1110. Thecapacitive force sensor 1110 can be defined by two electrical contactsseparated by a flexible material such as, but not limited to: silicone,plastic, glass, gel, and so on. The flexible material need not becontinuous; in the illustrated example, the flexible material isimplemented as a flexible contiguous layer, but this is not required.

The force input/haptic output interface 1100 also includes a stiffener1112 below the capacitive force sensor 1110. The stiffener 1112 can beconfigured and can function similar to stiffeners and backing platesdescribed herein. In particular, the stiffener 1112 may definelocally-flexible and/or locally-stiffened regions of the forceinput/haptic output interface 1100.

A haptic output element 1114 is positioned below the stiffener 1112. Thehaptic output element 1114 is separated from the frame 1104 by a gap1116. The gap 1116 is configured to permit the force input/haptic outputinterface 1100 to flex in response to a force applied by a user or ahaptic output generated by the haptic output element 1114. In otherexamples, the gap 1116 can be larger or smaller. The gap 1116 may have auniform or non-uniform thickness. In some cases, the gap 1116 can befilled with a filler material such as, but not limited to: compressiblefoam; compressible adhesive; compressible liquid; and so on. In othercases, the gap 1116 may be filled with a gas such as air.

FIG. 12 depicts a cross-section of another example force transducercoupled to a substrate associated with a force input/haptic outputinterface 1200, such as described herein. The force input/haptic outputinterface includes an external cover 1202 that defines an input surfaceto receive user input and to provide haptic output. The external cover1202 is positioned over and coupled to a frame 1204 via a compressibleseal 1206. As with other embodiments described herein, a touch inputsensor 1208 is disposed below an interior surface of the external cover1202. In this example, a haptic actuator (described in greater detailbelow) is coupled below the frame 1204.

In the illustrated embodiment, a force input sensor 1210 is disposedbelow the touch input sensor 1208 of the external cover 1202, such thatthe force input sensor 1210 experiences strain in proportion to amagnitude of force applied to the external cover 1202.

The force input sensor 1210 can be constructed in any number of suitableways. For example, in one embodiment, the force input sensor 1210 isimplemented as a piezoelectric sheet configured to compress orexpand—and generate a charge measureable as a voltage spike—in responseto a force applied to the external cover 1202. In another embodiment,the force input sensor 1210 is implemented as a strain sensor. A strainsensor be formed from one or more traces of peizoresistive material. Inanother example, a strain sensor can be an inductive strain sensorconfigured to exhibit a change in inductance proportional to orotherwise related to a strain experienced by the external cover 1202 inresponse to a force applied to the external cover 1202.

The force input sensor 1210 is offset from the frame 1204, and therebyable to flex, by a separator 1212 (e.g., a spacer). The separator 1212can be formed from any number of suitable elastic or otherwise flexiblematerials such as, but not limited to: silicone; plastic; glass; gel; apressure-sensitive adhesive; and so on. In other cases, the separator1212 may not be flexible and can be formed form a material such as metalor rigid plastic. In these examples, local or global flexibility of theframe 1204 and/or flexibility of the compressible seal 1206 may providerelief for the force input/haptic output interface 1200 in response to aforce input from the user.

In this example, the frame includes a reduced-thickness section 1204 a.As with other embodiments described herein, the reduced-thicknesssection 1204 a can at least partially defined a locally-flexible regionof the frame 1204. The force input/haptic output interface 1200 alsoincludes a haptic actuator 1214 that is coupled to a reduced-thicknesssection 1204 a of the frame 1204. As with other embodiments describedherein, the haptic actuator 1214 can include a piezoelectric element.

As a result of the constructed depicted in FIG. 12, high-voltageelectronics that may be required to actuate the haptic actuator 1214 maybe physically and structurally isolated from low-voltage electronicsthat may be required to operate the touch input sensor 1208 and/or theforce input sensor 1210. Further, in some examples, the frame 1204 maybe formed from metal. In these examples, the frame 1204 may provideelectromagnetic shielding between the haptic actuator 1214 and the forceinput sensor 1210 and/or the touch input sensor 1208. As a result ofthese constructions, a total thickness of the force input/haptic outputinterface 1200 can be reduced.

FIG. 13 depicts a cross-section of another example force transducercoupled to a substrate associated with a force input/haptic outputinterface 1300, such as described herein. The force input/haptic outputinterface 1300 is configured similar to other embodiments (e.g., FIG.12) described herein. In this example, a force input sensor is coupledto a locally-flexible portion of a frame. The locally-flexible portionof the frame concentrates strain in the force input sensor, therebyincreasing the sensitivity of that sensor.

In particular, the force input/haptic output interface 1300 includes anexternal cover 1302 positioned over a frame 1304 and a compressible seal1306. A touch input sensor 1308 is disposed below the external cover1302, and is separated from a locally-flexible portion 1312 the frame1304 by a separator 1310. A haptic actuator 1314 is coupled to a lowersurface of the locally-flexible portion 1312. The force input/hapticoutput interface 1300 also includes a force input sensor 1316 that iscoupled to the locally-flexible portion 1312. The force input sensor1316 can be constructed in any number of suitable ways, such as thosedescribed in reference to FIG. 12. In this example, as with FIG. 12,electronics associated with the haptic actuator 1314 are physically andstructurally isolated from those associated with the touch input sensor1308.

In yet another embodiment, a force input sensor and a haptic actuatorcan be laminated in a single stack below an input surface. FIG. 14depicts a force input/haptic output interface includes an external cover1402 coupled to the frame 1404 via a compressible seal 1406. A touchinput sensor 1408 is coupled to an interior surface of the externalcover 1402. A force input sensor 1410 is disposed below the touch inputsensor 1408 of the external cover 1402. In this example, the force inputsensor 1410 is backed by a stiffener 1412. In typical embodiments thestiffener 1412 is formed from a rigid material such as metal, but thismay not be required. In other examples, the stiffener 1412 is formedfrom plastic or glass. In some cases, the stiffener 1412 is formed frommetal so as to electromagnetically shield the touch input sensor 1408.

The force input/haptic output interface 1400 also includes a hapticactuator 1414 that is coupled to a lower side of the stiffener 1412. Thehaptic actuator 1414 is separated from a reduced-thickness section 1404a of the frame 1404 by a gap 1416. The gap 1416 permits the stackdepicted in FIG. 14 to deform toward the frame 1404 in response to auser input. As with other embodiments described herein, the hapticactuator 1414 can include a piezoelectric element.

Many examples provided above include haptic actuators configured tocompress or expand in a direction parallel to a user input surface.However, this may not be required. For example, FIG. 15 depicts a forceinput/haptic output interface 1500 that includes an external cover 1502coupled to the frame 1504 via a compressible seal 1506. As with otherembodiments, a touch input sensor 1508 is coupled to an interior surfaceof the external cover 1502. A force input sensor (not shown) can bedisposed below the touch input sensor 1508 of the external cover 1502,or in any suitable location.

The force input/haptic output interface 1500 also includes a hapticactuator 1510 that is coupled between the frame 1504 and the touch inputsensor 1508. As a result of this construction, expansion or compressionof the haptic actuator 1510 perpendicular to the external cover 1502results in outward or inward expansion of the external cover 1502. Aswith other embodiments described herein, the haptic actuator 1510 can beany suitable haptic actuator such as a piezoelectric actuator, anelectroactive polymer actuator, a linear actuator, and so on.

The foregoing embodiments depicted in FIGS. 10-15 and the variousalternatives thereof and variations thereto are presented, generally,for purposes of explanation, and to facilitate an understanding ofvarious configurations of a force input/haptic output interface and thevarious components thereof, such as described herein. However, it willbe apparent to one skilled in the art that some of the specific detailspresented herein may not be required in order to practice a particulardescribed embodiment, or an equivalent thereof.

For example, it may be understood that, generally and broadly,embodiments described herein can arrange various components of a forceinput/haptic output interface in any suitable order. For example, aforce input sensor can be positioned: above, below, or adjacent to atouch input sensor; above, below, or adjacent to a haptic outputelement; above, below, or adjacent to a frame; above, below, or adjacentto a reduced-thickness section of a frame; above, below, or adjacent toa cover; and so on. Similarly, a haptic output element can bepositioned: above, below, or adjacent to a touch input sensor; above,below, or adjacent to a force input sensor; above, below, or adjacent toa frame; above, below, or adjacent to a reduced-thickness section of aframe; above, below, or adjacent to a cover; and so on. Similarly, aforce transducer configured to provide both haptic output and configuredto receive force input from a user can be positioned: above, below, oradjacent to a touch input sensor; above, below, or adjacent to a frame;above, below, or adjacent to a reduced-thickness section of a frame;above, below, or adjacent to a cover; and so on.

Generally and broadly, FIGS. 16-18 depict flow charts that correspond tovarious methods that may be associated with a force input/haptic outputinterface, such as described above.

FIG. 16 is a flow chart depicting example operations of a method offorming a haptic actuator, such as described herein. The method 1600begins at operation 1602 in which a reduced-thickness section is formedin or through a substrate. The reduced-thickness section can be formedin any manner including, but not limited to: ablation; abrasion;etching; punching; cutting; and so on. In some cases, thereduced-thickness section can be formed and/or introduced into thesubstrate while forming the substrate (e.g., molding). In some cases,the reduced-thickness section can be formed by adding material to thesubstrate adjacent to the region.

The thickness of the substrate can be changed to any suitable thicknessrelative to adjacent portions of the substrate. In some cases, thereduced-thickness section is an opening. In other cases, thereduced-thickness section has a uniform thickness, whereas in others,the thickness of the reduced-thickness section varies. Thereduced-thickness section can take any number of suitable shapes.

Next, at operation 1604, a force transducer is coupled adjacent to thereduced-thickness section. In some cases, the force transducer iscoupled directly to the reduced-thickness section. In other cases, theforce transducer is coupled directly to the reduced thickness region.

Next, at operation 1606, the force transducer can be coupled to drivecircuitry and/or sense circuitry. In many cases, the drive circuitry andthe sense circuitry are implemented as different portions of a singlecontroller in electrical communication or otherwise coupled to the forcetransducer.

FIG. 17 is a flow chart depicting example operations of another methodof forming a haptic actuator, such as described herein. The method 1700beings at operation 1702 in which an instruction to provide hapticfeedback is received. In typical embodiments, the instruction isreceived by a controller in signal communication with a set of forcetransducers or haptic actuators.

At operation 1704, a set or subset of haptic actuators of a set ofhaptic actuators (or force transducers) is selected. In some cases, asingle haptic actuator can be selected. In other cases, more than onehaptic actuator can be selected. In still further embodiments, allhaptic actuators of a set of haptic actuators can be selected.

At operation 1706, the set or subset of haptic actuators of the set ofhaptic actuators selected at operation 1704 can be actuated or driven bya controller or drive circuitry. In some cases, a drive signalcorresponding to each individual selected haptic actuator can be appliedto the respective haptic actuator. In some cases, the drive signal(s)applied to each haptic actuator are the same, whereas in others thedrive signal(s) may be unique to each haptic actuator of the set orsubset of haptic actuators of the set of haptic actuators selected atoperation 1704.

In one embodiment, the drive signals are configured to generate hapticoutputs that constructively interfere with one another at a particularlocation or selected location of an input or user interface surfaceassociated with or coupled to the haptic actuators. In other cases, thedrives signals are configured to generate haptic outputs thatdestructively interfere with one another at a particular location ormore than one location of the input or user interface surface. In othercases, the drive signals are configured to vibrate a region of the inputor user interface surface at a particular frequency.

It may be appreciated that the specific examples listed above are notexhaustive; any number of suitable drive signals can be applied to anynumber of haptic actuators.

FIG. 18 is a flow chart depicting example operations of a method ofreceiving force input. The method 1800 begins at operation 1802 in whichan indication that a user is touching an input surface or user interfacesurface is received. Next, at operation 1804, output from a force inputsensor and/or a force transducer is received. Finally, at operation1806, the output can be correlated to a non-binary magnitude of forceapplied to the input surface or user interface surface.

As noted above, many embodiments described herein reference a forceinput/haptic output interface operated in conjunction with a non-displayregion of a portable electronic device, such as a trackpad of a laptopcomputer. It may be appreciated, however, that this is merely oneexample; other configurations, implementations, and constructions arecontemplated in view of the various principles and methods of operation,and reasonable alternatives thereto, described in reference to theembodiments described above.

For example, without limitation, a force input/haptic output interfacecan be additionally or alternatively associated with: a display surface;an enclosure or enclosure surface; a planar surface; a curved surface;an electrically conductive surface; an electrically insulating surface;a rigid surface; a flexible surface; a key cap surface; a trackpadsurface; a display surface; and so on. The user interface surface canbe, without limitation: a front surface; a back surface; a sidewallsurface; or any suitable surface of an electronic device or electronicdevice accessory. Typically, the user interface surface of a forceinput/haptic output interface is an external surface of the associatedportable electronic device but this may not be required.

Further, although many embodiments reference a force input/haptic outputinterface positioned in a portable electronic device (such as a cellphone or tablet computer) it may be appreciated that a forceinput/haptic output interface can be incorporated into any suitableelectronic device, system, or accessory including but not limited to:portable electronic devices (e.g., battery-powered, wirelessly-powereddevices, tethered devices, and so on); stationary electronic devices;control devices (e.g., home automation devices, industrial automationdevices, aeronautical or terrestrial vehicle control devices, and soon); personal computing devices (e.g., cellular devices, tablet devices,laptop devices, desktop devices, and so on); wearable devices (e.g.,implanted devices, wrist-worn devices, eyeglass devices, and so on);accessory devices (e.g., protective covers such as keyboard covers fortablet computers, stylus input devices, charging devices, and so on);and so on.

One may appreciate that although many embodiments are disclosed above,that the operations and steps presented with respect to methods andtechniques described herein are meant as exemplary and accordingly arenot exhaustive. One may further appreciate that alternate step order or,fewer or additional operations may be required or desired for particularembodiments.

For example, as noted above a force transducer can be configured in anumber of suitable ways. An example force transducer includes a groundelectrode and a drive and/or sense electrode separated by a body formedfrom a material that is configured to contract or expand in the presenceof an electric field and, additionally, develop a measureable charge inresponse to compression or strain. Suitable materials include, but maynot be limited to: lead-based piezoelectric alloys; non-leaded materialssuch as metal niobates or barium titanate; in addition to electroactivepolymers. In other examples, other piezoelectric compositions ormulti-layered or interdigitated elements can be selected.

In many embodiments, a force transducer is communicably coupled to acontroller that includes drive circuitry and/or sense circuitry. Thedrive circuit is configured to apply a drive signal to the drive and/orsense electrode of the force transducer. The drive signal can be anysuitable signal including, but not limited to: a voltage bias; a voltagesignal; an alternating signal; and so on. In some cases, the drivesignal has an arbitrary waveform. The drive circuit can include one ormore signal processing stages that may be used to generate, augment, orsmooth the drive signal. For example, the drive circuit can include oneor more of, without limitation and in no particular order: amplifyingstages; filtering stage; multiplexing stages; digital-to-analogconversion stages; analog-to-digital conversion stages; comparisonstages; feedback stages; and so on. The drive circuit can be implementedwith analog circuit components, digital circuit components, passivecircuit components, and/or active circuit components. In some examples,the drive circuit is implemented as an integrated circuit.

As with the drive circuit, the sense circuit, configured to receivevoltage signals from the force transducer, can be implemented in anynumber of suitable ways. In many examples, the sense circuit includesone or more signal processing stages that may be used to receive,amplify, augment, or smooth a sense signal obtained from one or more ofthe sense electrodes. For example, the sense circuit can include one ormore of, without limitation and in no particular order: amplifyingstages; filtering stages; multiplexing stages; digital-to-analogconversion stages; analog-to-digital conversion stages; comparisonstages; feedback stages; and so on. The sense circuit can be implementedwith analog circuit components, digital circuit components, passivecircuit components, and/or active circuit components. In some examples,the sense circuit is implemented as a single integrated circuit.

Once a sense signal (or more than one sense signal) is obtained, thesense circuit can correlate the one or more properties of the sensesignal(s) to an amount of compression or strain experienced by the forcetransducer. In other cases, the sense circuit can correlate themeasurement directly to an amount of force applied to the forcetransducer.

In many cases, drive circuitry and sense circuitry (or, more generally,a “controller”) can be configured to operate a haptic actuator and aforce input sensor simultaneously. In these examples, sense circuitrycan be configured to adjust an output received from a force input sensorbases on an operation of drive circuitry. For example, in oneembodiment, a sense signal received by sense circuitry may have anincreased amplitude due to a simultaneously or substantiallysimultaneous actuation of a haptic actuator. In this example, the sensecircuitry can be configured to adjust and/or filter the sense signalbased on the drive signal. In other cases, a sense signal received bysense circuitry may have a decreased amplitude due to a simultaneouslyor substantially simultaneous actuation of a haptic actuator. In thisexample, the sense circuitry can compensate for effects of the actuationby increasing the amplitude of the sense signal based on the drivesignal. In still other cases, the sense signal and the drive signal maybe out-of-band with respect to one another. For example, a drive signalmay have a central frequency between 100 Hz and 250 Hz whereas a sensesignal may have a central frequency between 0 Hz and 10 Hz. In theseexamples, the sense circuitry may be configured with a low-pass filter.

It may be appreciated that any implementation of any embodimentdescribed herein can be configured in this manner. For example, withreference to the electronic device 100 depicted in FIG. 1, the set offorce transducers of the force input/haptic output interface 110 can beused to user provide haptic output to a user and/or to receive forceinput from the user. For example, in a first mode (e.g., a “drive mode”or a “haptic mode”), the set of force transducers can be operatedindividually or collectively (e.g., constructively or destructivelyinterfering at one or more locations) to produce a haptic output throughthe user interface surface. The haptic output can be any suitableoutput, such as a click, vibration, lateral shift, vertical shift, andso on.

In many cases, a haptic output is generated in conjunction with afunction or operation of the electronic device 100. For example, a userof the electronic device 100 can receive a first haptic output afterselecting (e.g., with a cursor) a first element rendered in a graphicaluser interface displayed by the primary display 104. The user canreceive a second haptic output after selecting a second element renderedin the same graphical user interface. The first or second haptic outputsmay be transient or sustained.

In some cases, one or more characteristics of a haptic output generatedby the set of force transducers can depend upon a mode, state,application, function, setting, operation, or task of the electronicdevice 100. A haptic characteristic can include, but may not be limitedto: duration; intensity; amplitude; sound; location; type ofdisplacement; frequency of vibration; amount of ring-down compensation;and so on. Any suitable haptic characteristic can be used.

In further cases, more than one haptic output can be generated by theset of force transducers at a particular time. For example, a firstforce transducer located at a first location of the user interfacesurface can generate a first haptic output while a second forcetransducer located at a second location of the user interface surfacecan generate a second haptic output. The different haptic outputs may beassociated with different locations of the user interface surface.

In another example, in a second mode (e.g., a “sense mode” or an “inputmode”), the set of force transducers can be operated individually orcollectively to produce an electrical signal in response to a forceinput applied to the user interface surface. The electrical signal canbe correlated (e.g., by a controller or circuitry in signalcommunication with the set of force transducers) to a magnitude and/orlocation of force applied by one or more objects in contact with theuser interface surface. In some examples, the force input/haptic outputinterface 110 can be operated in the sense mode and the drive modesimultaneously. In other cases, the force input/haptic output interface110 can alternatively operate in the drive mode and the sense mode.

Further to the foregoing, although the disclosure above is described interms of various exemplary embodiments and implementations, it should beunderstood that the various features, aspects and functionalitydescribed in one or more of the individual embodiments are not limitedin their applicability to the particular embodiment with which they aredescribed, but instead can be applied, alone or in various combinations,to one or more of the some embodiments of the invention, whether or notsuch embodiments are described and whether or not such features arepresented as being a part of a described embodiment. Thus, the breadthand scope of the present invention should not be limited by any of theabove-described exemplary embodiments but is instead defined by theclaims herein presented.

What is claimed is:
 1. An electronic device comprising: an enclosureformed at least partially from glass, the enclosure having a firstthickness, the enclosure comprising: an external surface; an interiorsurface opposite the external surface; and a locally-flexible regiondefined in the interior surface, the locally-flexible region including areduced thickness section having a second thickness that is less thanthe first thickness, the locally-flexible region including a supportstructure adjacent to the reduced-thickness section, the supportstructure having a third thickness that is less than the first thicknessand greater than the second thickness; and a haptic actuator coupled tothe locally-flexible region, wherein: actuation of the haptic actuatorinduces a deformation into the locally-flexible region therebygenerating a haptic output at an external surface of the enclosure;wherein the first, second, and third thicknesses are measured relativeto the external surface.
 2. The electronic device of claim 1, whereinthe haptic actuator is coupled to the support structure.
 3. Theelectronic device of claim 1, further comprising: the locally-flexibleregion is one of a set of locally-flexible regions distributed acrossthe interior surface; and the haptic actuator is one of a set of hapticactuators, each of the set of haptic actuators coupled to a respectiveone locally-flexible region of the set of locally-flexible regions. 4.The electronic device of claim 3, further comprising: a keyboarddisposed at least partially within the enclosure; wherein: the set oflocally-flexible regions extends parallel to a length of the keyboard.5. The electronic device of claim 1, further comprising: drive circuitryin communication with the haptic actuator; wherein: the drive circuitryis configured to actuate the haptic actuator.
 6. The electronic deviceof claim 1, wherein: the locally-flexible region defines a first openingthrough the enclosure; the locally-flexible region further defines asecond opening though the enclosure that is aligned with, and offsetfrom, the first opening; the first and second openings at leastpartially define a support structure; and the haptic actuator is coupledto the support structure.
 7. The electronic device of claim 1, whereinthe enclosure further comprises a frame coupled to the interior surface.8. The electronic device of claim 7, wherein a flexibility of thelocally-flexible region is defined, at least in part, by the frame. 9.The electronic device of claim 8, further comprising a separatorseparating at least a portion of the frame from the interior surface.10. The electronic device of claim 9, further comprising a force inputsensor coupled to the interior surface.
 11. The electronic device ofclaim 10, wherein the force input sensor is a capacitive force sensorconfigured to measure a change in capacitance resulting from compressionof the separator.
 12. The electronic device of claim 1 furthercomprising: a keyboard within the enclosure; wherein the haptic actuatoris one haptic actuator of a set of haptic actuators, the set of hapticactuators each being directly coupled to the interior surface of theenclosure and extending along a length of the keyboard; a set of forceinput sensors coupled to the interior surface; and a controller incommunication with the set of haptic actuators and the set of forceinput sensors, the controller configured to: actuate the one hapticactuator of the set of haptic actuators; and receive a signal from aforce input sensor of the set of force input sensors, the signalcorresponding to a magnitude of an input force applied to the externalsurface.
 13. The electronic device of claim 12, further comprising atouch input sensor.
 14. The electronic device of claim 12, wherein theforce input sensor of the set of force input sensors is coupled to theinterior surface adjacent to the locally-flexible region.
 15. Anelectronic device comprising: an enclosure comprising: an exteriorexternal surface; an interior surface comprising: a locally-flexibleregion defined in the interior surface and comprising: areduced-thickness section having a first thickness; and a beam having aperimeter defined by the reduced-thickness section, the beam having asecond thickness greater than the first thickness; a piezoelectricelement coupled to the beam; and a controller in communication with thepiezoelectric element and configured to drive the piezoelectric elementto induce a bending moment into the beam; wherein the first and secondthicknesses are measured relative to the external surface of theenclosure, the external surface being opposite the interior surface. 16.The electronic device of claim 15, wherein the piezoelectric element isa first piezoelectric element; and the controller is configured to drivethe first piezoelectric element and a second piezoelectric elementsimultaneously to generate a haptic output.
 17. The electronic device ofclaim 15, wherein: the enclosure is formed from a glass substrate havinga third thickness; and the third thickness is greater than the secondthickness.